My Publication List

My Research Interest:
Photonics, Electronic Packaging & Technology, Superconductivity

1.1. Issued Patents
1. US Patent No. 6,873,770
Leung; Bernard Nai Wing; Hung; Kwok Chi; Lo; Chung Yuen ; Tsun; John Tak On; So; Alex Chun Kwan; Tam; Doris Po Fai; “Optical fiber array”; March 29, 2005.
2. US Patent No. 6,885,806
Lo; Chuen Yuen; Leung; Bernard Nai Wing; Hung; Kwok Chi; “Method of making an optical fiber array by overlapping stripped portions of ribbon fibers”; April 26, 2005.

1.2. Peer-reviewed Journal Papers
1. Y. C. Chan, M. O. Alam, K.C. Hung, H. Lu and C. Bailey, “Effect of underfill entrapment on the reliability of flip-chip solder joint”, ASME Journal of Electronic Packaging, Vol. 126, No. 4, pp. 541-545, 2004,.
2. M.A. Uddin, H.P. Chan, K.W. Lam, Y.C. Chan, P.L. Chu, K.C. Hung, T.O. Tsun, “Delamination Problems of UV-Cured Adhesive Bonded Optical Fiber in V-Groove for Photonic Packaging”, IEEE Photonics Technology Letter, Vol. 16, No. 4, pp. 1113-1115, 2004.
3. M.O. Alam, Y. C. Chan and K.C. Hung, “Interfacial Reaction of Pb-Sn Solder and Sn-Ag Solder with Electroless Ni Deposit During Reflow”, Journal of Electronic Materials, Vol. 31, No. 10, pp. 1117-1121, 2002.
4. M. O. Alam, Y. C. Chan, and K. C. Hung, “Reliabilty Study of Electroless Ni-P Layer against Solder Alloy”, Journal of Microelectronics Reliability, Vol. 42, No. 7, pp. 1065-1073, 2002.
5. H. Lu, K. C. Hung, S. Stoyanov, C. Bailey and Y. C. Chan, “No-flow underfill flip chip assembly - an experimental and modeling analysis”, Microelectronics Reliability, Vol. 42, No. 8, pp. 1205-1212, 2002.
6. C.F. Luk, Y. C. Chan, K.C. Hung, “Application of adhesive bonding techniques in hard disk drive head assembly”, Microelectronics Reliability, Vol. 42, No. 4-5, pp. 767-777, 2002.
7. C.F. Luk, Y. C. Chan and K.C. Hung, “Development of Gold to Gold Interconnection Flip Chip Bonding for Chip On Suspension Assemblies”, Microelectronics Reliability, Vol. 42, No. 3, pp. 381-389, 2002.
8. C.W. Tang, Y.C. Chan, K.C. Hung, and P.L. Tu, “Correlation between the Mechanical Strength and Curing Condition of No-flow Flip Chip Assemblies”, Journal of Electronic Packaging, Vol. 128, pp. 397-402, 2002.
9. C.W. Tang, Y.C. Chan, K.C. Hung and D.P. Webb, “Nondestructure Methodology for Standoff Height Measurement of Flip Chip on Flex (FCOF) by SAM”, IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part B: Advanced Packaging, Vol. 24, No. 2, pp. 163-168, 2001.
10. P. L. Tu, Y. C. Chan and K. C. Hung, “Reliability of microBGA assembly using no-flow underfill”, Microelectronics Reliability, Vol. 41, No. 12, pp. 1993-2000, 2001.
11. P.L. Tu, Y.C. Chan, and K.C. Hung, “Study of the Self-alignment of No-flow Underfill for MicroBGA Assembly”, Microelectronics Reliability, Vol. 41, No. 11, pp. 1867-1875, 2001..
12. Y. C. Chan, S. H. Fan and K. C. Hung, “The effect of metal oxide on the no-flow underfill fluxing capacity”, Materials Science and Engineering B, Vol. 85, No. 1, pp. 64-69, 2001.
13. P.L. Tu, Y.C. Chan, K.C. Hung, and J.K.L. Lai, “Growth Kinetics of Intermetallic Compounds in Chip Scale Package Solder Joint”, Scripta Materialia, Vol. 44, No. 2, pp.317-323, 2001.
14. P.L. Tu, Y.C. Chan, K.C. Hung, and J.K.L. Lai, “Study of Micro-BGA Solder Joint”, Microelectronics Reliability, Vol. 41, No. 2, pp. 287-293, 2001.
15. Y.C. Chan, P.L. Tu, C.W. Tang, K.C. Hung, and J.K.L. Lai, “Reliability Studies of mBGA solder joints ---Effect of Ni-Sn intermetallic Compound”, IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part B: Advanced Packaging, Vol. 24, No. 1, pp. 25-32, 2001.
16. K.C. Hung, Y.C. Chan, and C.W. Tang, “Metallurgical Reaction and Mechanical Strength of Electroless Ni-P Solder Joints for Advanced Packaging Applications”, Journal of Materials Science: Materials in Electronics, Vol. 11, No. 8, pp. 587-593, 2000.
17. P.L. Tu, Y.C. Chan, K.C. Hung, and J.K.L. Lai, “Comparative Study of mBGA Reliability Under Bending Stress”, IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part B: Advanced Packaging, Vol. 23, No. 4, pp. 750-756, 2000.
18. K.C. Hung, Y.C. Chan, P.L. Tu, H.C. Ong, D.P. Webb, and J.K.L. Lai, “Study of Self-Alignment of mBGA Packages”, IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part B: Advanced Packaging, Vol. 23, No. 4, pp. 631-636, 2000.
19. K.C. Hung, Y.C. Chan, C.W. Tang, and H.C. Ong, “Correlation between Ni3Sn4 Intermetallics and Ni3P due to Solder Reaction-assisted Crystallization of Electroless Ni-P Metallization in Advanced Packages”, Journal of Materials Research, Vol. 15, No. 11, pp. 2534-2539, 2000.
20. H.C. Ong, J.Y. Dai, K.C. Hung, Y.C. Chan, R.P.H. Chang, and S.T. Ho, "Electronic Structures of Polycrystalline ZnO Thin Films Probed by Electron Energy Loss Spectroscopy", Applied Physics Letters, Vol. 77, No. 10, pp. 1484-1486, 2000.
21. K.C. Hung and Y.C. Chan, “Study of Ni3P Growth due to Solder Reaction-assisted Crystallization of Electroless Ni-P Metallization”, Journal of Materials Science Letters, Vol. 19, No. 19, pp. 1755-1757, 2000.
22. K.C. Hung, Y.C. Chan, H.C. Ong, P.L. Tu, and C.W. Tang, “Effect of Pinhole Au/Ni/Cu Substrate on Self-alignment of Advanced Packages”, Materials Science and Engineering B, Vol. 76, No. 2, pp. 87-94, 2000.
23. Y.C. Chan, K.C. Hung, and X. Dai, “Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing”, IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part B: Advanced Packaging, Vol. 23, No. 1, pp. 80-87, 2000.
24. J.Q. Li, C.C. Lam, K.C. Hung, and L.J. Shen, “Enhancement of critical current density in HgBa2Ca2Cu3O8+d superconductor doped by Sb”, Physica C, Vol. 304, No. 1-2, pp. 133-145, 1998.
25. J.Q. Li, C.C. Lam, J. Feng, and K.C. Hung, “Effect of In doping in Hg1-xInxBa2CaCu2O6+d”, Supercond. Sci. Technol., Vol. 11, No. 2, pp. 217-222, 1998.
26. J.Q. Li, C.C. Lam, J. Feng and K.C. Hung, “Effects of Sn doping in Hg1-xSnxBa2Ca2Cu3O8+d superconductor”, Physica C, Vol. 292, No. 3-4, pp. 295-304, 1997.
27. C.C. Lam, G.J. Shen, C.L. Fu, and K.C. Hung, “TEM study on the formation of stacking faults by consecutive irradiation of energetic electrons in the Ca-doped YBCO system”, Supercond. Sci. Technol., Vol. 10, No. 11, pp. 807-812, 1997.
28. J.Q. Li, C.C. Lam, J. Feng, K.C. Hung and C.L. Fu, “Investigation of the BaO-CaO-CuO Ternary System at 850°C”, Z. Metallkd., Vol. 88, No. 9, pp. 698-700, 1997.
29. K.C. Hung, C.C. Lam, H.M. Shao, S.D. Wang, and X.X. Yao, “Enhancement in flux pinning and irreversibility field by means of short time annealing technique for HgBa2Ca2Cu3O8.4 superconductor”, Supercond. Sci. Technol., Vol. 10, No. 11, pp. 836-842, 1997.
30. K.C. Hung, C.C. Lam, X. Jin, J. Feng, and H.M. Shao, “Vortex dynamics in Pb-doped Hg-1234 superconductor by ac susceptibility response”, Physica C, Vol. 280, No. 4, pp. 317-326, 1997.
31. K.C. Hung, X. Jin, C.C. Lam, J.F. Geng, W.M. Chen, and H.M. Shao, “Thermally assisted flux flow in Hg0.69Pb0.31Ba2Ca3Cu4O10+d superconductor”, Supercond. Sci. Technol., Vol. 10, No. 8, pp. 562-567, 1997.
32. J.Q. Li, C.C. Lam, H.Q. Xiong, W.M. Chen, L.W. Shao, X. Jin, J. Feng, S.R. Qi, and K.C. Hung, “Effect of hydrogenation on positron annihilation in the superconductor of YBa2Cu3Oy”, Physica C, Vol. 282-287, Pt. 3, pp. 1611-1612, 1997.
33. J. Feng, C.C. Lam, L.W. Shao, X. Jin, H.M. Shao, and K.C. Hung, “The surface characterization and the stability of Hg0.69Pb0.31Ba2Ca2Cu3O8+d high temperature superconductor”, Physica C, Vol. 282-287, Pt. 2, pp. 983-984, 1997.
34. K.C. Hung, C.C. Lam, J.Q. Li, and H.M. Shao, “Intergrowth structures and screw dislocations in Pb-doped Hg-1234 superconductor”, Physica C, Vol. 282-287, Pt. 2, pp. 907-908, 1997.
35. K.C. Hung, C.C. Lam, X. Jin, and H.M. Shao, “Effective pinning potential in Pb-doped Hg-1234 superconductor by ac susceptibility response”, Physica C, Vol. 282-287, Pt. 4, pp. 2173-2174, 1997.
36. K.C. Hung, C.C. Lam, X. Jin, and J. Feng, “Intergranular pinning properties in high-Tc superconductor by ac susceptibility response”, Physica C, Vol. 282-287, Pt. 4, pp. 2171-2172, 1997.
37. C.C. Lam, L. Jei, J.R. Jin, X. Jin, K.C. Hung, and H.M. Shao, “The TAFF effect in an infinite length rectangle-section sample of Pb-doped HgBa2Ca2Cu3Oy”, Physica C, Vol. 282-287, Pt. 4, pp. 2175-2176, 1997.
38. H.M. Shao, C.C. Lam, K.C. Hung, X.S. Wu and X.X. Yao, “Optimization and enhancement of transition temperature for HgBa2Ca2Cu3O8+d ceramic superconductors”, Physica C, Vol. 282-287, Pt. 3, pp. 1559-1560, 1997.
39. C.M. Lee, C.C. Lam, K.C. Hung, X. Jin, and H.M. Shao, “Physical characteristics of imaginary AC magnetic susceptibility of granular superconductor”, Physica C, Vol. 282-287, Pt. 4, pp. 2245-2246, 1997.
40. C.C. Lam, X. Jin, K.C. Hung, and H.M. Shao, “Thermally activated flux creep velocity in Hg0.69Pb0.31Ba2Ca2Cu3O8+d”, Physica C, Vol. 282-287, Pt. 4, pp. 2367-2368, 1997.
41. X. Jin, C.C. Lam, K.C. Hung, C.M. Lee, and H.M. Shao, “AC response and current density relaxation”, Physica C, Vol. 282-287, Pt. 4, pp. 2243-2244, 1997.
42. C.C. Lam, K.C. Hung, J. Feng, X. Jin, and H.M. Shao, “AC susceptibility response and critical current density of a nominal Hg1-xPbxBa2Ca2Cu3O8+d superconductor for different critical state models”, Physica C, Vol. 282-287, Pt. 4, pp. 2307-2308, 1997.
43. J.F. Geng, W.M. Chen, K. Shen, A.M. Sun, X.N. Xu, X. Jin, C.C. Lam, K.C. Hung, and C.M. Lee, “AC response of thin cylindrical sample in high-Tc superconductors”, Chinese Journal of Low Temperature Physics, Vol. 19, No. 3, pp. 218-224, 1997.
44. J.F. Geng, W.M. Chen, A.M. Sun, X.N. Xu, X. Jin, C.C. Lam, K.C. Hung, and C.M. Lee, “Discussion of ac relaxation equation in high-Tc superconductors”, Chinese Journal of Low Temperature Physics, Vol. 19, No. 3, pp. 211-217, 1997.
45. W.M. Chen, C.C. Lam, L.Y. Li, J.F. Geng, F.M. Wu, K.C. Hung, and X. Jin, “An improved procedure for determining oxygen content in high-Tc copper oxides”, Journal of Superconductivity, Vol. 9, No. 5, pp. 551-554, 1996.
46. C.C. Lam, L.W. Shao, X. Jin, W.M. Chen, H.Q. Xiong, J. Feng, S.R. Qi, and K.C. Hung, “Positron annihilation in the hydrogenated granular superconductor of YBa2Cu3O7-d”, Physica C, Vol. 270, No. 3-4, pp. 333-342, 1996.
47. W.M. Chen, C.C. Lam, J.F. Geng, L.Y. Li, K.C. Hung, and X. Jin, “A new calculating formula of iodometric titration for high Tc superconductors”, Physica C, Vol. 270, No. 1-2, pp. 155-158, 1996.
48. C.C. Lam, L.W. Shao, X. Jin, H.M. Shao, and K.C. Hung, “The surface characterization and the stability of Hg0.69Pb0.31Ba2Ca2Cu3O8+d high-temperature superconductor”, Supercond. Sci. Technol., Vol. 9, No. 10, pp. 852-858, 1996.
49. C.C. Lam, H.M. Shao, J.H. Du, G.J. Shen, S.D. Wang, K.C. Hung, J.C.L. Chow, and X.X. Yao, “Tetragonal and orthorhombic prototype phase structures in the homologous series of pure and Pb-doped HgBa2Ca2Cu3O8+d superconductors”, Journal of Materials Science Letters, Vol. 14, No. 18, pp. 1271-1274, 1995.
50. C.C. Lam, S.D. Wang, H.M. Shao, G.J. Shen, J.C.L. Chow, P.C.W. Fung, S.L. Ho, H.Y. Lai, and K.C. Hung, “TEM observation of intergrowth structures in the HgBa2Ca2Cu3O8+d ceramic superconductor”, Physica C, Vol. 247, No. 1-2, pp. 43-54, 1995.
51. H.M. Shao, C.C. Lam, P.C.W. Fung, X.S. Wu, J.H. Du, G.J. Shen, J.C.L. Chow, S.L. Ho, K.C. Hung, and X.X. Yao, “The synthesis and characterization of HgBa2Ca2Cu3O8+d superconductors with substitution of Hg by Pb”, Physica C, Vol. 246, No. 3-4, pp. 207-215, 1995.

1.3. Invited Conference Papers
52. Y.C. Chan, K.C. Hung, C.W. Tang, and C.M.L. Wu, “Degradation Mechanisms of Anisotropic Conductive Adhesive Joints for Flip Chip on Flex Applications”, Proceedings of 4th International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, pp. 141-146, Finland 18-21 June, 2000.
53. K.C. Hung and Y.C. Chan, “Cooperative Research Centre for Conductive Adhesive Technology for High Density Electronic Packaging”, 4th International Academic Conference on Electronic Packaging Research, Education and Training for the New Millennium, Hong Kong, March, 2001.

1.4. Conference Papers
54. H. Lu, K.C. Hung, S. Stoyanov, C. Bailey, and Y.C. Chan, “Reliability Analysis of No-flow Underfill Materials”, accepted for presentation in InterPACK’01 Conference, Hawaii, July, 2001.
55. C.F. Luk, Y.C. Chan, and K.C. Hung, “Application of Adhesive Bonding Techniques in Hard Disk Drive Head Assembly”, accepted for presentation in InterPACK’01 Conference, Hawaii, July, 2001.
56. Y.C. Chan, C.F. Luk, and K.C. Hung, “Development of Gold to Gold Interconnection Flip Chip Bonding for Chip On Suspension Assemblies”, accepted for presentation in IEEE 51st Electronic Components and Technology Conference, Orlando, May, 2001.
57. D.A. Hutt, D.P. Webb, K.C. Hung, C.W. Tang, P.P. Conway and Y.C. Chan, “Scanning Acoustic Microscopy Investigation of Engineered Flip-chip Delamination”, 25th IEEE/CPMT International Electronics Manufacturing Technology Symposium, USA 2-3 October, 2000.
58. C.W. Tang, Y.C. Chan, K.C. Hung and D.P. Webb, “Standoff Height Measurement of Flip Chip Assemblies by Scanning Acoustic Microscopy”, Proceedings of IMAPS International Symposium on Advanced Packaging Materials, Processes, Properties and Interfaces, pp. 189-197, 2000.
59. P.L. Tu, C.W. Tang, Y.C. Chan, K.C. Hung, and J.K.L. Lai, “Effect of Ni/Sn Intermetallic on Fatigue Lifetime of mBGA Solder Joints”, Proceedings of 1st International Workshop on Electronics Materials and Packaging, pp. 25-30, 1999.
60. K.C. Hung and Y.C. Chan, “Nondestructive detection of defects in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processing”, Proceedings of the 23th IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 122-127, 1998.